EP80579 Datasheet, PDF (1912/1916 Pages) Intel Corporation – Intel® EP80579 Integrated Processor Product Line

Intel^® EP80579 Integrated Processor
50.1.1 Specifications
50.1.2
Thermal Design Power (TDP) Dissipation
The Thermal Design Power (TDP) values in Table 50-1 assume full-speed operation by
all peripherals and internal components in a realistic application. This TDP value
provides a high-level estimate for target applications.
The processor’s power is specified as Thermal Design Power (TDP) for thermal solution
design. TDP is defined as a system design target associated with the maximum
component operating temperature specifications. TDP values are determined based on
typical DC electrical specification and maximum component temperature for a realistic-
case application running at maximum utilization. The Intel TDP specification is a
recommended design point and is not representative of the absolute maximum power
the processor may dissipate under worst-case conditions. For any excursions beyond
TDP, the processor passive cooling feature is available to maintain the processor
thermal specifications. Refer to Section 50.2, “Thermal Sensor”
Table 50-1. EP80579 Thermal Design Power (TDP) and Maximum Case Temperature
Specifications (T_C-MAX)
Intel^® EP80579 Integrated Processor
Intel^® EP80579 Integrated Processor
with Intel^® QuickAssist Technology
SKU
2
8
4
6
1
3
7
5
Processor Frequency
(MHz)
600
TDP¹ (Watts)
11
600
1066
1200
600
1066
1066
1200
11
18
19
13
20
20
21
T_CASE-MAX
100°C
100°C
97°C
95°C
100°C
97°C
97°C
95°C
Notes:
1.
Thermal Design Power (TDP) is a system design target associated with the maximum component
operating temperature specifications. TDP values are determined based on typical DC electrical
specification and maximum component temperature for a realistic-case application running at
maximum utilization.
Refer to Section 50.0, “Thermal Specifications and Design Considerations” for further
thermal specifications.
50.2
Thermal Sensor
An independent thermal sensor helps control the silicon temperature by activating the
thermal control sequence when the EP80579 reaches its maximum operating
temperature. The temperature at which the EP80579 activates this thermal control
sequence is not user configurable and is not visible to the software.
The thermal sensor is an independent sensor that provides two outputs, THRMTRIP#
and PROCHOT#. Refer to Section 50.2.1, “Catastrophic Thermal Protection” for details
about THRMTRIP# and to Section 50.2.2, “Thermal Sensor Features” for details about
PROCHOT#.
The EP80579 provides the IA-32 core thermal monitor. The IA-32 core thermal monitor
has a throttling capability that can be activated via software or pre-boot firmware.
Refer to Section 50.2.2.2, “Processor Passive Cooling” and Section 50.2.2.3, “On-
Demand Passive Cooling” for details.
Intel^® EP80579 Integrated Processor Product Line Datasheet
1912
August 2009
Order Number: 320066-003US