SH7763 Datasheet, PDF (2010/2026 Pages) Renesas Technology Corp – Renesas 32-Bit RISC Microcomputer SuperHTM RISC Engine Family SH-4A Series

Appendix
J. Heat Radiation
This LSI is assumed to be used under the condition of Tj (junction temperature) ≤ 125°C.
Accordingly, if Tj can possibly exceed 125°C, some heat radiation measures should be taken. For
reference, the following sections show the heat resistance simulation results of this LSI; determine
the measures to be taken so that a condition of Tj ≤ 125°C should be satisfied. Here, note that the
following sections only show the simulation results, not the guaranteed values or measures.
J.1 Heat Resistance Simulation Conditions
(1) Circuit Board Model on which this LSI is Mounted: JEDEC Standard Board (PCB)
• Structure: Four-layer board of 101.5 mm × 114.5 mm × t1.6 mm (2S2P)
• Routing rate: 20% - 100% - 100% - 20%
(2) Heat Resistance Simulation Environment
• Heat resistance simulation environment: JEDEC standard environment (300-mm cubic casing);
Ta (ambient temperature) = 75°C or 60°C; windless.
• Casing: Acrylic (300 mm × 300 mm × 300 mm in size)
Figure J.1 shows the overall view of the simulation model.
(3) Power Consumption
• Power consumption: 2.4 W (maximum value when this LSI is operating in normal operating
mode)
(4) Heat Sink Model
• Heat sink: Aluminum
• Thermal conductivity: 215.9 W/mK
Figure J.2 shows the heat sink model.
Rev. 1.00 Oct. 01, 2007 Page 1944 of 1956
REJ09B0256-0100