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PXS20RM Datasheet, PDF (139/1368 Pages) Freescale Semiconductor, Inc – PXS20 Microcontroller
Chapter 7
Functional Safety
Functional Safety
7.1 Overview
This device offers a set of features to support using it for applications which need to fulfill functional safety
requirements as defined by safety integrity levels SIL3 of IEC61508 and other corresponding
certifications.. Also, the development processes and documentation of this device target these safety
standards. This device is considered a Type B subsystem (“complex”, see IEC 61508-2, section 7.4.3.1.
Architectural constraints on hardware safety integrity) and is assumed to be used in a
“High-Demand / Continuous mode of operation“ safety mode (see IEC 61508-1, section 7.6.2,
“Requirements”).
7.2 Redundancy
The main approach used to achieve functional safety requirements is redundancy. Redundancy is applied
in different ways for different modules of this device:
• Processing cores: When used for a safety critical application, the two redundant cores must be used
in lock-step mode. Any difference between the outputs of the cores indicates a fault and triggers
the according reaction to prevent propagation of the fault and to put the device into a Fail-Safe
mode.
• Replicated peripherals, if safety critical for the application, have to be used in a redundant way by
the application software. Details are specified in the Safety Application Guide.
• Non-replicated input peripherals, if safety critical for the application and not self-tested, have to be
read twice by the application software. Details are specified in the Safety Application Guide.
• Non-replicated output peripherals, if safety critical for the application and not read-back, have to
be written twice by the application software. Details are specified in the Safety Application Guide.
7.3 Built-In Self-Test (BIST)
7.3.1 BIST during boot
A device BIST is performed every time a destructive or external reset occurs. The device provides full
reset conditions to the outside world while BIST is executed. The BIST is performed transparently for the
application while the device is still under reset. In case the BIST fails, the device is kept under reset.
Application software can only start to run when BIST finished successfully without detecting a fault. The
boot time BIST comprises:
• Memory BIST for all RAMs and ROM
• Scan-based Logic BIST for three partitions of digital logic (for the contents of the individual
partitions see hierarchy definition).
PXS20 Microcontroller Reference Manual, Rev. 1
Freescale Semiconductor
7-1