UPD78F1502AGK-GAK-AX Datasheet, PDF (955/1031 Pages) Renesas Technology Corp – 16-Bit Single-Chip Microcontrollers

78K0R/Lx3
CHAPTER 33 RECOMMENDED SOLDERING CONDITIONS
Table 33-1. Surface Mounting Type Soldering Conditions (2/2)
(2) 80-pin plastic LQFP (14×14)
μ PD78F1500AGC-GAD-AX, 78F1501AGC-GAD-AX, 78F1502AGC-GAD-AX,
78F1510AGC-GAD-AX, 78F1512AGC-GAD-AX
Soldering Method
Soldering Conditions
Infrared reflow
Wave soldering
Partial heating
Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),
Count: 3 times or less, Exposure limit: 7 days^Note (after that, prebake at 125°C for
10 to 72 hours)
Solder bath temperature: 260°C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120°C max. (package surface temperature),
Exposure limit: 7 days^Note (after that, prebake at 125°C for 10 to 72 hours)
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
Recommended
Condition Symbol
IR60-107-3
WS60-107-1
−
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution
The 78K0R/Lx3 microcontroller has an on-chip debug function, which is provided for development and
evaluation. Do not use the on-chip debug function in products designated for mass production,
because the guaranteed number of rewritable times of the flash memory may be exceeded when this
function is used, and product reliability therefore cannot be guaranteed. Renesas Electronics is not
liable for problems occurring when the on-chip debug function is used.
R01UH0004EJ0501 Rev.5.01
939
Jun 20, 2011