UPD78F1502AGK-GAK-AX Datasheet, PDF (15/1031 Pages) Renesas Technology Corp – 16-Bit Single-Chip Microcontrollers

27.3 Communication Mode .............................................................................................................. 835
27.4 Connection of Pins on Board.................................................................................................. 837
27.4.1 FLMD0 pin................................................................................................................................... 837
27.4.2 TOOL0 pin................................................................................................................................... 838
27.4.3 RESET pin .................................................................................................................................. 838
27.4.4 Port pins ...................................................................................................................................... 838
27.4.5 REGC pin .................................................................................................................................... 838
27.4.6 X1 and X2 pins ............................................................................................................................ 838
27.4.7 Power supply............................................................................................................................... 839
27.5 Registers Controlling Flash Memory...................................................................................... 839
27.6 Programming Method .............................................................................................................. 840
27.6.1 Controlling flash memory............................................................................................................. 840
27.6.2 Flash memory programming mode.............................................................................................. 840
27.6.3 Selecting communication mode .................................................................................................. 841
27.6.4 Communication commands ......................................................................................................... 841
27.7 Security Settings ...................................................................................................................... 843
27.8 Flash Memory Programming by Self-Programming ............................................................. 845
27.8.1 Boot swap function ...................................................................................................................... 847
27.8.2 Flash shield window function....................................................................................................... 849
27.9 Creating ROM Code to Place Order for Previously Written Product .................................. 850
27.9.1 Procedure for using ROM code to place an order ................................................................... 850
CHAPTER 28 ON-CHIP DEBUG FUNCTION ..................................................................................... 851
28.1 Connecting QB-MINI2 to 78K0R/Lx3 microcontrollers ......................................................... 851
28.2 On-Chip Debug Security ID ..................................................................................................... 852
28.3 Securing of User Resources ................................................................................................... 852
CHAPTER 29 BCD CORRECTION CIRCUIT ..................................................................................... 854
29.1 BCD Correction Circuit Function............................................................................................ 854
29.2 Registers Used by BCD Correction Circuit ........................................................................... 854
29.3 BCD Correction Circuit Operation .......................................................................................... 855
CHAPTER 30 INSTRUCTION SET........................................................................................................ 857
30.1 Conventions Used in Operation List ...................................................................................... 857
30.1.1 Operand identifiers and specification methods............................................................................ 857
30.1.2 Description of operation column .................................................................................................. 858
30.1.3 Description of flag operation column ........................................................................................... 859
30.1.4 PREFIX instruction ...................................................................................................................... 859
30.2 Operation List ........................................................................................................................... 860
CHAPTER 31 ELECTRICAL SPECIFICATIONS ................................................................................. 877
CHAPTER 32 PACKAGE DRAWINGS ................................................................................................. 934
32.1 78K0R/LF3............................................................................................................................... 934
32.2 78K0R/LG3 .............................................................................................................................. 936
32.3 78K0R/LH3 .............................................................................................................................. 937
CHAPTER 33 RECOMMENDED SOLDERING CONDITIONS........................................................... 938