UPD78F1502AGK-GAK-AX Datasheet, PDF (954/1031 Pages) Renesas Technology Corp – 16-Bit Single-Chip Microcontrollers

78K0R/Lx3
CHAPTER 33 RECOMMENDED SOLDERING CONDITIONS
CHAPTER 33 RECOMMENDED SOLDERING CONDITIONS
These products should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, please contact a Renesas Electronics
sales representative.
For technical information, see the following website.
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Semiconductor Device Mount Manual (http://www.renesas.com/prod/package/manual/index.html)
Table 33-1. Surface Mounting Type Soldering Conditions (1/2)
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(1) 80-pin plastic LQFP (fine pitch) (12×12)
μ PD78F1500AGK-GAK-AX, 78F1501AGK-GAK-AX, 78F1502AGK-GAK-AX,
78F1510AGK-GAK-AX, 78F1512AGK-GAK-AX
100-pin plastic LQFP (fine pitch) (14x14)
μ PD78F1503AGC-UEU-AX, 78F1504AGC-UEU-AX, 78F1505AGC-UEU-AX,
78F1513AGC-UEU-AX, 78F1515AGC-UEU-AX
128-pin plastic LQFP (fine pitch) (14x20)
μ PD78F1506AGF-GAT-AX, 78F1507AGF-GAT-AX, 78F1508AGF-GAT-AX,
78F1516AGF-GAT-AX, 78F1518AGF-GAT-AX
Soldering Method
Soldering Conditions
Infrared reflow
Partial heating
Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),
Count: 3 times or less, Exposure limit: 7 days^Note (after that, prebake at 125°C for
10 to 72 hours)
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
Recommended
Condition Symbol
IR60-107-3
−
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
<R> ^{Caution The 78K0R/Lx3 microcontroller has an on-chip debug function, which is provided for development and}
evaluation. Do not use the on-chip debug function in products designated for mass production,
because the guaranteed number of rewritable times of the flash memory may be exceeded when this
function is used, and product reliability therefore cannot be guaranteed. Renesas Electronics is not
liable for problems occurring when the on-chip debug function is used.
R01UH0004EJ0501 Rev.5.01
938
Jun 20, 2011