AC82G41SLGQ3 Datasheet, PDF (597/604 Pages) Intel Corporation – Intel® 4 Series Chipset Family

Ballout and Package Specifications
15.2 Package Specifications
Figure 21.
The (G)MCH is available in a 34 mm [1.34 in] x 34 mm [1.34 in] Flip Chip Ball Grid
Array (FC-BGA) package with 1254 solder balls (see Figure 21). Refer to the Intel^® 4
Series Chipset Family Thermal and Mechanical Design Guide for details.
(G)MCH Package Drawing
Datasheet
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