HC4GX15 Datasheet, PDF (17/668 Pages) Altera Corporation – HardCopy IV Device Handbook

Chapter 1: HardCopy IV Device Family Overview
1–7
Features
Table 1–4. Stratix IV E FPGA Prototype-to-HardCopy IV E ASIC Mapping Paths
Stratix IV E FPGA Prototype and Package
HardCopy IV E ASIC
EP4SE230
EP4SE360
EP4SE530
EP4SE820
Device
HC4E25
HC4E35
Package
484-pin FineLine
BGA
780-pin FineLine
BGA
1152-pin FineLine
BGA
1517-pin FineLine
BGA
F780
v (1)
v
—
—
H780
—
F1152
—
H1152 H1517 H1152 H1517
—
—
—
—
v (2)
—
—
—
—
—
—
v v (2) — v (2) —
—
—
— v (2) —
v
Notes to Table 1–4:
(1) This mapping is a non-socket replacement path that requires a different board design for the Stratix IV E device and the HardCopy IV E device.
(2) The Hybrid FBGA package for the Stratix IV E FPGAs requires additional unused board space along the edges beyond the footprint, but its
footprint is compatible with the regular FBGA package. The HardCopy IV E ASICs are in the regular FBGA packages.
Three different FineLine BGA package substrate options are available for the
HardCopy IV devices:
■ Performance-optimized flip chip package (F)
■ Cost-optimized flip chip package (L, LA)
■ Low-cost wire bond package (W)—available for HardCopy IV E ASICs only
All three package types support direct replacement of the Stratix IV FPGA prototype.
The performance-optimized flip chip package supports equivalent performance and
the same number of I/Os as the corresponding FPGA prototype. The cost-optimized
flip chip package uses a substrate with fewer layers and no on-package decoupling
(OPD) capacitors to offer a low-cost package option. The performance is reduced from
that of the FPGA prototype. However, the number of available I/Os remains the
same. The wire bond package offers another low-cost package option, but with the
trade-off of reduced performance and fewer available I/Os.
1 If you are going to use the low-cost wire bond package, make sure your design uses
I/Os that are available in that package.
For HardCopy IV E non-socket replacement devices, only the performance-optimized
flip chip package and the low-cost wire bond package are supported.
© January 2010 Altera Corporation
HardCopy IV Device Handbook, Volume 1