HC4GX15 Datasheet, PDF (156/668 Pages) Altera Corporation – HardCopy IV Device Handbook

11–6
Chapter 11: Power Supply and Temperature Sensing Diode in HardCopy IV Devices
HardCopy IV Power Optimization
Figure 11–3. HardCopy IV GX Power Management Example (Data Rates Between 4.25 Gbps and 6.5 Gbps) (Note 1), (2)
. DC Input Board Supply
Switcher
.^.9V
VCC
VCCHIP
Filter
VCCD_PLL
VCCIO
.
Switcher
.^2.5V
VCCPD
VCCPGM
VCC_CLKIN
.
Linear or Switcher ^1.1V
VCCR_L/R
VCCT_L/R
VCCL_GXB_L/R
.
Linear or Switcher ^1.5V _{VCCL_GXB_L/R}
.
Filter
VCCAUX
Filter
VCCA_PLL
Linear or ^3.0V
Switcher
VCCA_L/R
Notes to Figure 11–3:
(1) These guidelines are preliminary and are pending characterization.
(2) For best performance, Altera recommends keeping these rails isolated from each other.
HardCopy IV Power Optimization
Because HardCopy IV devices have lower power than Stratix IV devices,
HardCopy IV devices do not need programmable power technology. Therefore, this
option is not needed in HardCopy IV devices. The Quartus^® II software compiles your
HardCopy IV design according to the timing requirements specified in the timing
constraint file. Due to smaller device geometry and optimized device architecture,
HardCopy IV devices generally achieve faster performance and consume less power
than Stratix IV devices. Depending on resource utilization and frequency of
operation, HardCopy IV core power is typically reduced 20% to 50%, when compared
with Stratix IV FPGAs. Compilation reports show the power and performance of both
the HardCopy IV ASIC and the Stratix IV FPGA.
Temperature Sensing Diode (TSD)
The HardCopy IV TSD uses the characteristics of a PN junction diode to determine
die temperature. Knowing the junction temperature is crucial for thermal
management. Junction temperature is calculated using ambient or case temperature,
junction-to-ambient (_JA) or junction-to-case (_JC) thermal resistance, and the device
power consumption.
HardCopy IV Device Handbook, Volume 1
© January 2010 Altera Corporation