82801CA Datasheet, PDF (485/521 Pages) Intel Corporation – I/O Controller Hub 3-S (ICH3-S)

Package Information
Package Information
17
Figure 17-1 illustrates the ICH3 421 BGA package. All dimensions are in millimeters.
Figure 17-1. Intel^® ICH3 Package
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE
AND ITS CONTENTS MAY NOT BE DISCLOSED WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
// 0.127 A
-A-
31.00 ±0.20
26.00 ±0.25
PIN #1 IDENTIFIER
16.96 REF
-B-
31.00 ±0.20
26.00 ±0.25
3 X C1.00 THRU
16.96 REF
0.127 A
45D CHAMFER
4 PLACES
NOTES:
1. ALL DIMENSIONS AND TOLERANCES CONFORM
TO ANSI Y14.5M-1982.
2. DIMENSION IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER, PARALLEL TO PRIMARY
DATUM -C- .
3. PRIMARY DATUM -C- AND SEATING PLANE
ARE DEFINED BY THE SPHERICAL CROWNS OF
THE SOLDER BALLS.
4. ALL DIMENSIONS UNLESS OTHERWISE SPECIFIED
ARE IN MILLIMETERS
TOP VIEW
2
Ø
0.90
0.60
Ø 0.30 ^S C A ^S B ^S
1.27
1.53 REF
2322212019181716151413121110 9 ⁸ 7 ⁶ 5 ⁴ 3 ² 1
PIN #1
CORNER
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
1.53 REF
1.27
BOTTOM VIEW
2.38 ±0.21
1.17 ±0.05
30°
0.61 ±0.06
0.60 ±0.10
SIDE VIEW
// _{0.15 C}
0.15
-C-
3
SEATING PLANE
Intel^® 82801CA ICH3-S Datasheet
485