LAN9353 Datasheet, PDF (503/523 Pages) Microchip Technology – Interfaces at up to 200Mbps via Turbo MII

LAN9353
20.3 Package Thermal Specifications
TABLE 20-1: 64-PIN QFN PACKAGE THERMAL PARAMETERS
Parameter
Symbol
Value
Thermal Resistance Junction to Ambient
_JA
23.6
Thermal Resistance Junction to Bottom of Case
_JT
0.1
Thermal Resistance Junction to Top of Case
_JC
1.8
Units
°C/W
°C/W
°C/W
Comments
Measured in still air
Measured in still air
Airflow 1 m/s
TABLE 20-2: 64-PIN TQFP-EP PACKAGE THERMAL PARAMETERS
Parameter
Thermal Resistance Junction to Ambient
Thermal Resistance Junction to Bottom of Case
Thermal Resistance Junction to Top of Case
Symbol
_JA
_JT
_JC
Value
29.0
0.3
12.8
Units
°C/W
°C/W
°C/W
Comments
Measured in still air
Measured in still air
Airflow 1 m/s
Note: Thermal parameters are measured or estimated for devices in a multi-layer 2S2P PCB per JESDN51.
TABLE 20-3: MAXIMUM POWER DISSIPATION
Mode
Internal Regulator Disabled, 2.5 V Ethernet Magnetics
Internal Regulator Disabled, 3.3 V Ethernet Magnetics
Internal Regulator Enabled, 2.5 V Ethernet Magnetics
Internal Regulator Enabled, 3.3 V Ethernet Magnetics
Maximum Power (mW)
752
927
973
1148
20.4 Current Consumption and Power Consumption
This section details the device’s typical supply current consumption and power dissipation for 10BASE-T, 100BASE-TX
and power management modes of operation with the internal regulator enabled and disabled.
Note: Each mode in the current consumption and power dissipation tables assumes all PHYs are in the corre-
sponding mode of operation.
 2015 Microchip Technology Inc.
DS00001925A-page 503