HD64F2168 Datasheet, PDF (860/874 Pages) Renesas Technology Corp – Renesas 16-Bit Single-Chip Microcomputer

C. Package Dimensions
For package dimensions, dimensions described in Renesas Semiconductor Packages have priority.
108
109
18.0 ± 0.2
16
73
72
Unit: mm
144
1
*0.18 ± 0.05
0.16 ± 0.04
37
36
0.07 M
1.0
1.0
0.08
*Dimension including the plating thickness
Base material dimension
0.5 ± 0.1
0° – 8°
Package Code
JEDEC
EIAJ
Weight (reference value)
TFP-144
—
Conforms
0.6 g
Figure C.1 Package Dimensions (TFP-144)
Rev. 3.00, 03/04, page 820 of 830