EP4SE360F35I4 Datasheet, PDF (27/432 Pages) Altera Corporation – This section provides a complete overview of all features relating to the Stratix IV device family, which is the most architecturlly advanced

Table 1–2 lists the Stratix IV GX device package options.
Table 1–2. Stratix IV GX Device Package Options ⁽¹⁾, ⁽²⁾
Device
F780
(29 mm x 29 mm) ⁽⁶⁾
F1152
(35 mm x 35 mm)
(6)
F1152
(35 mm x 35 mm) ⁽⁵⁾, ⁽⁷⁾
F1517
(40 mm x 40 mm)
(5)_, (7)
F1760
(42.5 mm x 42.5 mm)
(7)
F1932
(45 mm x 45 mm)
(7)
EP4SGX70
DF29
—
—
EP4SGX110
DF29
—
FF35
EP4SGX180
DF29
—
FF35
EP4SGX230
DF29
—
FF35
EP4SGX290
—
FH29 ⁽³⁾
FF35
EP4SGX360
—
FH29 ⁽³⁾
FF35
EP4SGX530
—
—
—
HF35
HF35
—
—
—
—
—
—
—
HF35
HF35
HF35
HF35
HH35 ⁽⁴⁾
—
—
KF40
KF40
KF40
KF40
KH40 ⁽⁴⁾
—
—
—
—
KF43
KF43
KF43
—
—
—
—
NF45
NF45
NF45
Notes to Table 1–2:
(1) Device packages in the same column and marked under the same arrow sign have vertical migration capability.
(2) Use the Pin Migration Viewer in the Pin Planner to verify the pin migration compatibility when migrating devices. For more information, refer to I/O Management in the Quartus II Handbook, Volume 2.
(3) The 780-pin EP4SGX290 and EP4SGX360 devices are available only in 33 mm x 33 mm Hybrid flip chip package.
(4) The 1152-pin and 1517-pin EP4SGX530 devices are available only in 42.5 mm x 42.5 mm Hybrid flip chip packages.
(5) When migrating between hybrid and flip chip packages, there is an additional keep-out area. For more information, refer to the Package Information Datasheet for Altera Devices.
(6) Devices listed in this column are available in –2x, –3, and –4 speed grades. These devices do not have on-package decoupling capacitors.
(7) Devices listed in this column are available in –2, –3, and –4 speed grades. These devices have on-package decoupling capacitors. For more information about on-package decoupling capacitor value
in each device, refer to Table 1–3.
1 On-package decoupling reduces the need for on-board or PCB decoupling capacitors by satisfying the transient current
requirements at higher frequencies. The Power Delivery Network design tool for Stratix IV devices accounts for the on-package
decoupling and reflects the reduced requirements for PCB decoupling capacitors.