EP2AGX95EF29C6N Datasheet, PDF (170/380 Pages) Altera Corporation – Device Interfaces and Integration

6–6
Chapter 6: I/O Features in Arria II Devices
I/O Banks
Arria II GZ devices contain up to 20 I/O banks as shown in Figure 6–2. Each I/O bank
can support high-performance external memory interfaces with dedicated circuitry.
The I/O pins are organized in pairs to support differential standards. Each I/O pin
pair can support both differential input and output buffers except the clk[1,3,8,10],
PLL_L[1,4]_clk, and PLL_R[1,4]_clk pins, which support differential input
operations only.
Figure 6–2. I/O Banks in Arria II GZ Devices (Note 1), (2), (3), (4), (5), (6), (7), (8)
Bank 8A
Bank 8B
Bank 8C
Bank 7C
Bank 7B
Bank 7A
I/O banks 8A, 8B & 8C support all
single-ended and differential input
and output operation.
I/O banks 7A, 7B & 7C support all
single-ended and differential input
and output operation.
Row I/O banks support LVTTL, LVCMOS, 2.5-V, 1.8-
V, 1.5-V, 1.2-V, SSTL-2 Class I & II, SSTL-18 Class I
& II, SSTL-15 Class I, HSTL-18 Class I & II, HSTL-15
Class I, HSTL-12 Class I, LVDS, RSDS, mini-LVDS,
differential SSTL-2 Class I & II, differential SSTL-18
Class I & II, differential SSTL-15 Class I, differential
HSTL-18 Class I & II, differential HSTL-15 Class I and
differential HSTL-12 Class I standards for input and
output operation.
SSTL-15 class II, HSTL-15 Class II, HSTL-12 Class II,
differential SSTL-15 Class II, differential HSTL-15
Class II, differential HSTL-12 Class II standards are
only supported for input operations
I/O banks 3A, 3B & 3C support all
single-ended and differential input
and output operation.
I/O banks 4A, 4B & 4C support all
single-ended and differential input
and output operation.
Bank 3A
Bank 3B
Bank 3C
Bank 4C
Bank 4B
Bank 4A
Notes to Figure 6–2:
(1) Differential HSTL and SSTL outputs are not true differential outputs. They use two single-ended outputs with the second output programmed as
inverted.
(2) Column I/O differential HSTL and SSTL inputs use LVDS differential input buffers without R_D OCT support.
(3) Column I/O supports LVDS outputs using single-ended buffers and external resistor networks.
(4) Column I/O supports PCI/PCI-X with an on-chip clamp diode. Row I/O supports PCI/PCI-X with an external clamp diode.
(5) Clock inputs on column I/Os are powered by V_CCCLKIN when configured as differential clock inputs. They are powered by V_CCIO when configured as
single-ended clock inputs. All outputs use the corresponding bank V_CCIO.
(6) Row I/O supports the true LVDS output buffer.
(7) Column and row I/O banks support LVPECL standards for input clock operation.
(8) Figure 6–2 is a top view of the silicon die that corresponds to a reverse view for flip chip packages. It is a graphical representation only.
Arria II Device Handbook Volume 1: Device Interfaces and Integration
December 2011 Altera Corporation