PIC16LF18854 Datasheet, PDF (665/668 Pages) Microchip Technology – C Compiler Optimized RISC Architecture

PIC16(L)F18856/76
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
[X]⁽¹⁾
-
X
/XX
XXX
Examples:
Device Tape and Reel Temperature Package
Option
Range
Pattern
Device:
PIC16F18856; PIC16LF18856;
PIC16F18876; PIC16LF18876
a) PIC16F18856- E/SP
Extended temperature
SPDIP package
b) PIC16F18876- I/P
Industrial temperature
PDIP package
Tape and Reel
Option:
Blank = Standard packaging (tube or tray)
T
= Tape and Reel⁽¹⁾
Temperature
Range:
Package:⁽²⁾
Pattern:
I
= -40C to +85C (Industrial)
E
= -40C to +125C (Extended)
ML = 28-lead QFN 6x6mm
ML = 40-lead QFN 8x8mm
MV = 28-lead UQFN 4x4x0.5mm
MV = 40-lead UQFN 5x5x0.5mm
P
= 40-lead PDIP
PT = 44-lead TQFP 10x10x1
SO = 28-lead SOIC
SP = 28-lead SPDIP
SS = 28-lead SSOP
QTP, SQTP, Code or Special Requirements
(blank otherwise)
Note 1:
2:
Tape and Reel identifier only appears in
the catalog part number description. This
identifier is used for ordering purposes and
is not printed on the device package.
Check with your Microchip Sales Office
for package availability with the Tape and
Reel option.
Small form-factor packaging options may
be available. Please check
www.microchip.com/packaging for
small-form factor package availability, or
contact your local Sales Office.
 2016 Microchip Technology Inc.
Preliminary
DS40001824A-page 665