PIC16LF18854 Datasheet, PDF (659/668 Pages) Microchip Technology – C Compiler Optimized RISC Architecture

PIC16(L)F18856/76
44-Lead Plastic Thin Quad Flatpack (PT) - 10X10X1 mm Body, 2.00 mm Footprint [TQFP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
C1
44
1
2
G
C2
Y1
X1
E
RECOMMENDED LAND PATTERN
SILK SCREEN
Notes:
Units
Dimension Limits
Contact Pitch
E
Contact Pad Spacing
C1
Contact Pad Spacing
C2
Contact Pad Width (X44)
X1
Contact Pad Length (X44)
Y1
Distance Between Pads
G
MILLIMETERS
MIN
NOM
MAX
0.80 BSC
11.40
11.40
0.55
1.50
0.25
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing No. C04-2076B
 2016 Microchip Technology Inc.
Preliminary
DS40001824A-page 659