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| PIC16LF18854 Datasheet, PDF (612/668 Pages) Microchip Technology – C Compiler Optimized RISC Architecture | |||
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PIC16(L)F18856/76
TABLE 37-6: THERMAL CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Param.
No.
Sym.
Characteristic
Typ.
Units
Conditions
TH01
ï±JA Thermal Resistance Junction to Ambient
60
80
ï°C/W
ï°C/W
28-pin SPDIP package
28-pin SOIC package
90
ï°C/W 28-pin SSOP package
27.5
ï°C/W 28-pin UQFN 4x4 mm package
27.5
ï°C/W 28-pin QFN 6x6mm package
47.2
ï°C/W 40-pin PDIP package
46
ï°C/W 44-pin TQFP package
24.4
ï°C/W 44-pin QFN 8x8mm package
TH02
ï±JC Thermal Resistance Junction to Case
31.4
ï°C/W 28-pin SPDIP package
24
ï°C/W 28-pin SOIC package
24
ï°C/W 28-pin SSOP package
24
ï°C/W 28-pin UQFN 4x4mm package
24
ï°C/W 28-pin QFN 6x6mm package
24.7
ï°C/W 40-pin PDIP package
14.5
ï°C/W 44-pin TQFP package
20
ï°C/W 44-pin QFN 8x8mm package
TH03
TJMAX Maximum Junction Temperature
150
ï°C
TH04
TH05
PD Power Dissipation
PINTERNAL Internal Power Dissipation
â
W
PD = PINTERNAL + PI/O
â
W
PINTERNAL = IDD x VDD(1)
TH06
TH07
PI/O
PDER
I/O Power Dissipation
Derated Power
â
W
PI/O = ï (IOL * VOL) + ï (IOH * (VDD - VOH))
â
W
PDER = PDMAX (TJ - TA)/ï±JA(2)
Note 1: IDD is current to run the chip alone without driving any load on the output pins.
2: TA = Ambient Temperature, TJ = Junction Temperature
DS40001824A-page 612
Preliminary
ï£ 2016 Microchip Technology Inc.
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