PIC16LF18854 Datasheet, PDF (658/668 Pages) Microchip Technology – C Compiler Optimized RISC Architecture

PIC16(L)F18856/76
44-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1.0 mm Body [TQFP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
H
c
L
θ
(L1)
SECTION A-A
Units
Dimension Limits
Number of Leads
N
Lead Pitch
e
Overall Height
A
Standoff
A1
Molded Package Thickness
A2
Overall Width
E
Molded Package Width
E1
Overall Length
D
MILLIMETERS
MIN
NOM
MAX
44
0.80 BSC
-
-
1.20
0.05
-
0.15
0.95
1.00
1.05
12.00 BSC
10.00 BSC
12.00 BSC
Notes:
Molded Package Length
Lead Width
Lead Thickness
Lead Length
Footprint
Foot Angle
D1
10.00 BSC
b
0.30
0.37
0.45
c
0.09
-
0.20
L
0.45
0.60
0.75
L1
1.00 REF
θ
0°
3.5°
7°
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Exact shape of each corner is optional.
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-076C Sheet 2 of 2
DS40001824A-page 658
Preliminary
 2016 Microchip Technology Inc.