PIC16LF18854 Datasheet, PDF (608/668 Pages) Microchip Technology – C Compiler Optimized RISC Architecture

PIC16(L)F18856/76
TABLE 37-2: SUPPLY CURRENT (IDD)^(1,2,4)
PIC16LF18856/76
Standard Operating Conditions (unless otherwise stated)
PIC16F18856/76
Param.
No.
Symbol
Device Characteristics
Min. Typ.† Max. Units
VDD
Conditions
Note
D100 IDDXT4
XT = 4 MHz
— 360 600 A 3.0V
D100 IDDXT4
XT = 4 MHz
— 380 700 A 3.0V
D101 IDDHFO16
HFINTOSC = 16 MHz
— 1.4 2.0 mA 3.0V
D101 IDDHFO16
HFINTOSC = 16 MHz
— 1.5 2.1 mA 3.0V
D102 IDDHFOPLL HFINTOSC = 32 MHz
— 2.6 3.6 mA 3.0V
D102 IDDHFOPLL HFINTOSC = 32 MHz
— 2.7 3.7 mA 3.0V
D103 IDDHSPLL32 HS+PLL = 32 MHz
— 2.6 3.6 mA 3.0V
D103 IDDHSPLL32 HS+PLL = 32 MHz
— 2.7 3.7 mA 3.0V
D104 IDDIDLE
IDLE mode, HFINTOSC = 16 MHz
— 1.05 — mA 3.0V
D104 IDDIDLE
IDLE mode, HFINTOSC = 16 MHz
— 1.15 — mA 3.0V
D105 IDDDOZE⁽³⁾ DOZE mode, HFINTOSC = 16 MHz, Doze Ratio = 16 — 1.1 — mA 3.0V
D105 IDDDOZE⁽³⁾ DOZE mode, HFINTOSC = 16 MHz, Doze Ratio = 16 — 1.2 — mA 3.0V
† Data in “Typ.” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested.
Note 1:
2:
The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from
rail-to-rail; all I/O pins are outputs driven low; MCLR = VDD; WDT disabled.
The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switch-
ing rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption.
3: IDDDOZE = [IDDIDLE*(N-1)/N] + IDDHFO16/N where N = DOZE Ratio (Register 8-2).
4: PMD bits are all in the default state, no modules are disabled.
DS40001824A-page 608
Preliminary
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