S912XHZ512F1VAG Datasheet, PDF (897/978 Pages) Freescale Semiconductor, Inc – Covers MC9S12XHZ384, MC9S12XHZ256

Appendix A Electrical Characteristics
Table A-5. Thermal Package Characteristics¹
Num C
Rating
Symbol
Min
Typ
Max
Unit
LQFP144
1 T Thermal resistance LQFP144, single sided PCB²
θ_JA
—
—
41
°C/W
2 T Thermal resistance LQFP144, double sided PCB
with 2 internal planes³
θ_JA
—
—
32
°C/W
3
Junction to Board LQFP 144
4
Junction to Case LQFP 144⁴
5
Junction to Package Top LQFP144⁵
θ_JB
—
—
22
°C/W
θ_JC
—
—
7.4
°C/W
Ψ_JT
—
—
3
°C/W
LQFP112
6 T Thermal resistance LQFP112, single sided PCB²
θ_JA
—
—
43
°C/W
7 T Thermal resistance LQFP112, double sided PCB
with 2 internal planes³
θ_JA
—
—
32
°C/W
8
Junction to Board LQFP112
θ_JB
—
—
22
°C/W
9
Junction to Case LQFP112⁴
θ_JC
—
—
7
°C/W
10
Junction to Package Top LQFP112⁵
Ψ_JT
—
—
3
°C/W
1 _{The values for thermal resistance are achieved by package simulations}
2 _{Junction to ambient thermal resistance, θJA was simulated to be equivalent to the JEDEC specification JESD51-2 in a}
horizontal configuration in natural convection.
3 _{Junction to ambient thermal resistance, θJA was simulated to be equivalent to the JEDEC specification JESD51-7 in a}
horizontal configuration in natural convection.
A.1.9 I/O Characteristics
This section describes the characteristics of all I/O pins except EXTAL, XTAL,XFC,TEST and supply
pins.
MC9S12XHZ512 Data Sheet, Rev. 1.06
Freescale Semiconductor
897