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SH7032 Datasheet, PDF (526/687 Pages) Renesas Technology Corp – 32-Bit RISC Microcomputer
Section 20 Electrical Characteristics
Item
Symbol Min Max
Unit Figures
DACK0, DACK1 delay time 1 tDACD1 — 40
DACK0, DACK1 delay time 2 tDACD2 — 40
DACK0, DACK1 delay time 3*5 tDACD3 — 40
ns 20.21, 20.22, 20.24–
ns 20.27, 20.32, 20.33
ns 20.22, 20.26, 20.27,
20.32
DACK0, DACK1 delay time 4 tDACD4 — 40
ns 20.24, 20.25
DACK0, DACK1 delay time 5 tDACD5 — 40
ns
Read delay time 35% duty*1 tRDD
— tcyc × 0.35 + 35
ns
20.21, 20.22, 20.24-
50% duty
— tcyc × 0.5 + 35
ns 20.28, 20.32
Data setup time for CAS
tDS
0*3 —
ns 20.24, 20.26
CAS setup time for RAS
tCSR
10 —
ns 20.29–20.31
Row address hold time
tRAH
10 —
ns 20.24, 20.26
Write command hold time
Write command 35% duty*1
setup time
50% duty
tWCH
tWCS
tWCS
15 —
0—
0—
ns
ns 20.24
ns
Access time from CAS
precharge*4
tACP
tcyc —
–20
ns 20.25
Notes: 1. When frequency is 10 MHz or more.
2. n is the number of wait cycles.
3. –5 ns for parity output of DRAM long-pitch access
4. It is not necessary to meet the tRDS specification as long as the access time
specification is met.
5. In the relationship of tCASD2 and tCASD3 with respect to tDACD3, a Min-Max combination
does not occur because of the logic structure.
Rev. 7.00 Jan 31, 2006 page 500 of 658
REJ09B0272-0700