PIC18LF24K Datasheet, PDF (585/594 Pages) –

PIC18(L)F26/45/46K40
44-Lead Plastic Quad Flat, No Lead Package (ML) - 8x8 mm Body [QFN or VQFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
44
1
2
C1
X2
EV
EV
C2 Y2
G2
ØV
G1
Y1
E
SILK SCREEN
X1
RECOMMENDED LAND PATTERN
Units
Dimension Limits
Contact Pitch
E
Optional Center Pad Width
X2
Optional Center Pad Length
Y2
Contact Pad Spacing
C1
Contact Pad Spacing
C2
Contact Pad Width (X44)
X1
Contact Pad Length (X44)
Y1
Contact Pad to Contact Pad (X40) G1
Contact Pad to Center Pad (X44) G2
Thermal Via Diameter
V
Thermal Via Pitch
EV
MILLIMETERS
MIN
NOM
MAX
0.65 BSC
6.60
6.60
8.00
8.00
0.35
0.85
0.30
0.28
0.33
1.20
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
Microchip Technology Drawing No. C04-2103C
 2016 Microchip Technology Inc.
Preliminary
DS40001816C-page 585