82598EB Datasheet, PDF (9/596 Pages) Intel Corporation – Intel® 82598EB 10 Gigabit Ethernet Controller Datasheet

Intel^® 82598EB 10 GbE Controller - Contents
8.3.2.9 Signal Isolation ............................................................................................. 567
8.3.2.10 Power and Ground Planes ............................................................................... 568
8.4 Connecting the Serial EEPROM ..................................................................................................... 568
8.4.1 Supported EEPROM devices ............................................................................................ 568
8.4.2 EEUPDATE.................................................................................................................... 569
8.5 Connecting the Flash .................................................................................................................. 569
8.5.1 Supported EEPROM Devices............................................................................................ 569
8.6 Connecting the Manageability Interfaces ....................................................................................... 570
8.6.1 Connecting the SMBus Interface...................................................................................... 570
8.6.2 Connecting the NC-SI Interface....................................................................................... 570
8.6.3 NC-SI Electrical Interface Requirements ........................................................................... 571
8.6.3.1 External Baseboard Management Controller (BMC) ............................................. 571
8.6.3.2 NC-SI Reference Schematic ............................................................................ 571
8.7 Resets .................................................................................................................................. 573
8.8 NC-SI Layout Requirements......................................................................................................... 573
8.8.1 Board Impedance.......................................................................................................... 573
8.8.2 Trace Length Restrictions ............................................................................................... 573
8.8.3 Special Delay Requirements ........................................................................................... 575
8.9 Connecting the MDIO Interfaces................................................................................................... 575
8.10 Connecting the Software-Definable Pins (SDPs) .............................................................................. 575
8.11 Connecting the Light Emitting Diodes for Designs Based on the 82598 Controller ................................ 576
8.12 Connecting the Miscellaneous Signals............................................................................................ 576
8.12.1 LAN Disable.................................................................................................................. 576
8.12.2 BIOS Handling of Device Disable ..................................................................................... 578
8.12.3 PHY Disable and Device Power Down Signals .................................................................... 578
8.13 Oscillator Design Considerations................................................................................................... 578
8.13.1 Oscillator Types ............................................................................................................ 578
8.13.1.1 Fixed Crystal Oscillator ................................................................................... 578
8.13.1.2 Programmable Crystal Oscillators..................................................................... 579
8.13.2 Oscillator Solution ......................................................................................................... 579
8.13.3 Oscillator Layout Recommendations................................................................................. 580
8.13.4 Reference Clock Measurement Recommendations .............................................................. 580
8.14 Power Supplies .......................................................................................................................... 580
8.14.1 Power Supply Sequencing .............................................................................................. 580
8.14.1.1 Using Regulators With Enable Pins ................................................................... 581
8.14.2 Power Supply Filtering ................................................................................................... 581
8.14.3 Support for Power Management and Wake Up ................................................................... 581
8.15 Connecting the JTAG Port ............................................................................................................ 582
8.16 Thermal Design Considerations .................................................................................................... 582
8.16.1 Importance of Thermal Management................................................................................ 582
8.16.2 Packaging Terminology .................................................................................................. 582
8.16.3 Thermal Specifications ................................................................................................... 583
8.16.3.1 Case Temperature ......................................................................................... 584
8.16.4 Thermal Attributes ........................................................................................................ 584
8.16.4.1 Typical System Definition................................................................................ 584
8.16.4.2 Package Mechanical Attributes......................................................................... 584
8.16.4.3 Package Thermal Characteristics...................................................................... 584
8.16.5 Thermal Enhancements.................................................................................................. 586
8.16.5.1 Clearances.................................................................................................... 586
8.16.5.2 Default Enhanced Thermal Solution .................................................................. 587
8.16.5.3 Extruded Heatsinks ........................................................................................ 587
8.16.5.4 Thermal Considerations for Board Design .......................................................... 588
8.16.5.5 Thermal Interface Management for Heat-Sink Solutions ...................................... 589
8.16.6 Measurements for Thermal Specifications ......................................................................... 590
8.16.6.1 Case Temperature Measurements .................................................................... 590
8.16.6.2 Attaching the Thermocouple (No Heatsink)........................................................ 590
8.16.6.3 Attaching the Thermocouple (Heatsink) ............................................................ 591
8.16.7 Heatsink and Attach Suppliers......................................................................................... 592
8.16.8 PHY Suppliers ............................................................................................................... 592
9. Diagnostic Registers................................................................................................................ 593
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