82598EB Datasheet, PDF (589/596 Pages) Intel Corporation – Intel® 82598EB 10 Gigabit Ethernet Controller Datasheet

Intel^® 82598EB 10 GbE Controller - Thermal Enhancements
• Avoid placing the components downstream, behind larger devices or devices with heat sinks that
obstruct the air flow or supply excessively heated air.
IcePak* and FlowTherm* models are available; contact your Intel representative for information.
8.16.5.4.1 Reliability
Each PCA, system and heatsink combination varies in attach strength and long-term adhesive
performance. Evaluate the reliability of the completed assembly prior to high-volume use. Reliability
recommendations are shown in Table 8-11.
Table 8-11. Reliability Validation
Test1
Mechanical Shock
Random Vibration
High-Temperature
Life
Thermal Cycling
Humidity
Requirement
50G trapezoidal, board level
11 ms, 3 shocks/axis
7.3G, board level
45 minutes/axis, 50 to 2000 Hz
85 °C
2000 hours total
Checkpoints occur at 168, 500, 1000, and 2000 hours
Per-Target Environment
(for example: -40 °C to +85 °C)
500 Cycles
85% relative humidity
85 °C, 1000 hours
Pass/Fail Criteria2
Visual and Electrical Check
Visual and Electrical Check
Visual and Mechanical Check
Visual and Mechanical Check
Visual and Mechanical Check
1_{Performed the above tests on a sample size of at least 12 assemblies from 3 lots of material (total = 36 assemblies).}
2_{Additional pass/fail criteria can be added at your discretion.}
8.16.5.5 Thermal Interface Management for Heat-Sink Solutions
To optimize heatsink design, it is important to understand the interface between the heat spreader and
the heatsink base. Thermal conductivity effectiveness depends on the following:
• Bond line thickness
• Interface material area
• Interface material thermal conductivity
8.16.5.5.1 Bond Line Management
The gap between the heat spreader and the heatsink base impacts heat-sink solution performance. The
larger the gap between the two surfaces, the greater the thermal resistance. The thickness of the gap is
determined by the flatness of both the heatsink base and the heat spreader, plus the thickness of the
thermal interface material (for example, PSA, thermal grease, epoxy) used to join the two surfaces.
8.16.5.5.2 Interface Material Performance
The following factors impact the performance of the interface material between the heat spreader and
the heatsink base:
• Thermal resistance of the material
• Wetting/filling characteristics of the material
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