82598EB Datasheet, PDF (584/596 Pages) Intel Corporation – Intel® 82598EB 10 Gigabit Ethernet Controller Datasheet

Intel^® 82598EB 10 GbE Controller - Thermal Attributes
Table 8-8. Package Thermal Characteristics in Standard JEDEC Environment
Package
31 mm FCBGA
31 mm FCBGA -HS
(°C/W)
14.6¹
11.9²
(°C/W)
1.6
0.6
1 _{Integrated Circuit Thermal Measurement Method-Electrical Test Method EIA/JESD51-1, Integrated Circuits Thermal Test Method}
Environmental Conditions – Natural Convection (Still Air), No Heat sink attached EIAJESD51-2.
2 _{Natural Convection (Still Air), Heat sink attached.}
Table 8-9. T Estimated Thermal Design Power
82598 Estimated TDP¹ 6.5 W
Tcase Max-hs² 106 °C³
1_{Power values shown are preliminary and reflect pre-silicon simulation estimates; once silicon becomes available, Maximum power, also known}
as Thermal Design Power (TDP), is a system design target associated with the maximum component operating temperature specifications.
Maximum power values are determined based on typical DC electrical specification and maximum ambient temperature for a worst-case
realistic application running at maximum utilization.
2_{Tcase Max-hs is defined as the maximum case temperature with the Default Enhanced Thermal Solution attached.}
3_{This is a not to exceed maximum allowable case temperature.}
The thermal parameters defined above are based on simulated results of packages assembled on
standard multi layer 2s2p 1.0-oz Cu layer boards in a natural convection environment. The maximum
case temperature is based on the maximum junction temperature and defined by the relationship,
maximum Tcase = Tjmax – (_JT x Power) where _JT is the junction-to-top (of package) thermal
characterization parameter. If the case temperature exceeds the specified Tcase max, thermal
enhancements such as heat sinks or forced air will be required. _JA is the thermal resistance junction-to-
ambient of the package.
8.16.3.1 Case Temperature
The 82598 is designed to operate properly as long as the Tcase rating is not exceeded.
8.16.4 Thermal Attributes
8.16.4.1 Typical System Definition
A system with the following attributes was used to generate thermal characteristics data:
• A heatsink case with the Default Enhanced Thermal Solution.
• Four-layer, 4.5 x 4 inch PCB.
8.16.4.2 Package Mechanical Attributes
The 82598 product line is packaged in a 31 mm x 31 mm FCBGA.
8.16.4.3 Package Thermal Characteristics
See Figure 8-10 and Table 8-10 to determine an optimum airflow and heatsink combination. Your
system design may vary from the system board environment used to generate the values shown.
Contact your Intel sales representative for product line thermal models.
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