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HD64F3048VTF8 Datasheet, PDF (685/903 Pages) Renesas Technology Corp – Hardware Manual Renesas 8-Bit Single-Chip
Section 21 Electrical Characteristics
Item
Symbol Min
Typ Max
Unit Test Conditions
Three-state Ports 1 to 6, |ITSI|
—
leakage
8 to B
current
(off state)
—
1.0
µA Vin = 0.5 to
VCC –0.5 V
Input pull-up Ports 2, 4,
–I
50
—
300
µA V = 0 V
P
in
MOS current and 5
Input
FWE
capacitance NMI
Cin
—
—
All input pins
—
except NMI,
FWE
Current
Normal
ICC*6
—
dissipation*2 operation*5
—
60
—
50
—
15
45
60
pF VIN = 0 V,
pF f = fmin,
pF Ta = 25°C
mA f = 25 MHz
Sleep mode
—
35
50
mA
Module standby
—
mode*4
Standby mode*3
—
—
Analog
During A/D
AICC
—
power
conversion
supply
current
During A/D and
D/A conversion
—
20
25
1
10
—
80
0.5
1.5
0.5
1.5
mA
µA Ta ≤ 50°C
µA 50°C < Ta
mA AVCC = 5.0 V
mA
Idle
—
0.01 5.0
µA DASTE = 0
Reference During A/D
AICC
—
current
conversion
0.4
0.8
mA VREF = 5.0 V
During A/D and
D/A conversion
—
1.5
3.0
mA
Idle
—
0.01 5.0
µA DASTE = 0
RAM standby voltage
VRAM
2.0
—
—
V
Notes: 1.
2.
If the A/D and D/A converters are not used, do not leave the AVCC, AVSS, and VREF pins
open. Connect AVCC and VREF to VCC, and connect AVSS to VSS.
Current dissipation values are for VIH min = VCC –0.5 V and VIL max = 0.5 V with all
output pins unloaded and the on-chip pull-up transistors in the off state.
3.
The
values
are
for
V
RAM
≤
V
CC
<
4.5
V,
V
IH
min
=
V
CC
×
0.9,
and
V
IL
max
=
0.3
V.
4. Module standby current values apply in sleep mode with all modules halted.
5. The current dissipation value for flash memory program/erase operations (Ta = 0°C to
+75°C) is 10 mA (max.) greater than the current dissipation value for normal operation.
Rev. 3.00 Sep 27, 2006 page 657 of 872
REJ09B0325-0300