TCI6636K2H Datasheet, PDF (357/362 Pages) Texas Instruments – Multicore DSP+ARM KeyStone II System-on-Chip (SoC)

TCI6636K2H
Multicore DSP+ARM KeyStone II System-on-Chip (SoC)
SPRS835F—October 2013
12 Mechanical Data
12.1 Thermal Data
Table 12-1 shows the thermal resistance characteristics for the PBGA - AAW mechanical package.
Table 12-1 Thermal Resistance Characteristics (PBGA Package) AAW
No.
1 Rθ_JC
2 Rθ_JB
End of Table 12-1
Junction-to-case
Junction-to-board
°C/W
0.11
1.65
12.2 Packaging Information
The following packaging information reflects the most current released data available for the designated device(s).
This data is subject to change without notice and without revision of this document.
Copyright 2013 Texas Instruments Incorporated
Submit Documentation Feedback
Mechanical Data 357