DS643 Datasheet, PDF (7/216 Pages) Xilinx, Inc – Soft Direct Memory Access (SDMA) support

LogiCORE IP Multi-Port Memory Controller (v6.06.a)
Memory and Memory Part Parameters
Table 3 lists the memory and memory part parameters.
Table 3: Memory and Memory Part Parameters
Parameter Name
Default Value Allowable Values
Description
C_MEM_ADDR_WIDTH
13
1-20
Number of external address pins.
C_MEM_AUTO_SR^(9),(11)
ENABLED
ENABLED, MANUAL
Auto self refresh. Set if high temperature
should be handled manually or
automatically.
C_MEM_BANKADDR_WIDTH
2
1-4
Number of external bank address pins.
C_MEM_BITS_DATA_PER_DQS
8
8
Number of data bits per DQS bit.
C_MEM_CAS_LATENCY⁽⁵⁾
0
C_MEM_CAS_WR_LATENCY^{(5),(11),(12)}
5
0–9
Auto-calculated memory CAS latency based
on clock speed.
5-8
DDR3 CAS write latency.
C_MEM_CE_WIDTH⁽¹²⁾
Number of external chip-enable pins. This
1
1-16
value is an automatically calculated
parameter that can be overwritten; if set by
the user, it is not calculated.
C_MEM_CLK_WIDTH⁽¹²⁾
Number of external clock pins. This value is
1
1-16
an automatically calculated parameter that
can be overwritten; if set by the user, it is not
calculated.
C_MEM_CS_N_WIDTH⁽¹²⁾
C_MEM_DATA_WIDTH⁽⁸⁾
Number of external chip-select pins. This
value is an automatically calculated
1
1-16
parameter that can be overwritten; if set by
the user, it is not calculated. This must be set
to an integer multiple of C_NUM_RANKS *
C_NUM_DIMMS.
64
4⁽⁹⁾,8,16,32,64
Number of external data pins.
C_MEM_DM_WIDTH
C_MEM_DQS_WIDTH^(2),(3),(11)
8
1,2,4,8
Number of external data mask pins.
8
1,2,4,8
Number of external DQS pins.
C_MEM_DQS_IO_COL
Used with older MIG versions. A DRC error
occurs if this parameter is set by the user.
x
any 18-bit value
See Memory Interface Generator PHY
Interface, page 89 for more information f
migrating from an older MPMC/MIG version.
C_MEM_DQ_IO_MS
0x00000000000
0000000
any 72-bit value
Used with older MIG versions. A DRC error
occurs if this parameter is set by the user.
See Memory Interface Generator PHY
Interface, page 89 for more information if
migrating from an older MPMC/MIG version.
C_MEM_DQS_LOC_COL0^(10),(16)
0
Hex number up 144 bits
DQS groups in column #1 - obtain value
from MIG tool.
C_MEM_DQS_LOC_COL1^(10),(16)
C_MEM_DQS_LOC_COL2^(10),(16)
C_MEM_DQS_LOC_COL3^(10),(16)
0
Hex number up 144 bits
DQS groups in column #2 - obtain value
from MIG tool.
0
Hex number up 144 bits DQS groups obtain value from MIG tool.
0
Hex number up 144 bits DQS groups obtain value from MIG tool.
C_MEM_DYNAMIC_WRITE_ODT^(9),(11)
OFF
OFF, DIV2, DIV4
Setting for Dynamic Write On-Die
Termination.
C_MEM_HIGH_TEMP_SR⁽⁹⁾
C_MEM_INCDEC_THRESHOLD⁽¹⁴⁾
NORMAL
2
NORMAL, EXTENDED
0-255
High Temperature Self Refresh. Higher
refresh rate is needed when 85°C is
exceeded.
MCB increment/decrement threshold.
C_MEM_NDQS_COL0^(10),(16)
0
0-18
Number of DQS groups in I/O column obtain
value from MIG tool.
DS643 February 22, 2013
www.xilinx.com
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Product Specification