C8051F970-A-GM Datasheet, PDF (21/454 Pages) Silicon Laboratories – Low Power Capacitive Sensing MCU with up to 32 kB of Flash

C8051F97x
1.2. Thermal Conditions
Table 1.15. Thermal Characteristics
Parameter
Thermal Resistance 
Junction to Ambient
Thermal Resistance 
Junction to Case
Symbol
_JA
_JC
Conditions
Still air, QFN 48
Still air, QFN 32
Still air, QFN 24
Still air, QFN 48
Still air, QFN 32
Still air, QFN 24
Min Typ Max
—
82
—
— 40.4 —
— 59.5 —
— 11.5 —
— 16.8 —
— 22.7 —
Units
°C/W
°C/W
1.3. Absolute Maximum Ratings
Stresses above those listed under Table 1.16 may cause permanent damage to the device. This is a stress rating
only and functional operation of the devices at those or any other conditions above those indicated in the operation
listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect
device reliability.
For more information on the available quality and reliability data, see the Quality and Reliability Monitor Report at
http://www.silabs.com/support/quality/pages/default.aspx.
Table 1.16. Absolute Maximum Limits
Parameter
Ambient Temperature under Bias
Storage Temperature
Voltage on any Port I/O Pin or RST
with Respect to GND
Voltage on V_DD with Respect to
GND
Maximum Total Current through V_DD
or GND
Maximum Current through RST or
any Port Pin
Maximum Total Current through all
Port Pins
Conditions
Min
Typ
–55
—
–65
—
–0.3
—
–0.3
—
—
—
—
—
—
—
Note: Exposure to maximum rating conditions for extended periods may affect device reliability.
Max
125
150
V_DD + 0.3
4.0
500
100
200
Units
°C
°C
V
V
mA
mA
mA
Rev 1.0
21