MMC2107 Datasheet, PDF (611/618 Pages) –

Freescale Semiconductor, Inc.
Mechanical Specifications
Package Information for the 144-Pin LQFP
23.4 Package Information for the 144-Pin LQFP
The production 144-pin package characteristics are:
• Joint-Electron Device Engineering Council (JEDEC) standard
• Low-profile quad flat pack (LQFP)
• Dimension: 20 x 20 mm
• Lead pitch: 0.5 mm
• Thin: 1.4 mm
• Case number: 918-03
• Clam shell socket: Yamaichi part #IC51-1444-1354
• Open face socket: Yamaichi part #IC201-1444-034
23.5 Package Information for the 100-Pin LQFP
The production 100-pin package characteristics are:
• JEDEC standard
• Low-profile quad flat pack (LQFP)
• Dimension: 14 x 14 mm
• Lead pitch: 0.5 mm
• Thin: 1.4 mm
• Case number: 983-02
• Clam shell socket: Yamaichi part #IC51-1004-809
• Open face socket: Yamaichi part #IC201-1004-008
MMC2107 – Rev. 2.0
MOTOROLA
Mechanical Specifications
For More Information On This Product,
Go to: www.freescale.com
Technical Data
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