MMC2107 Datasheet, PDF (610/618 Pages) –

Freescale Semiconductor, Inc.
Mechanical Specifications
23.3 Bond Pins
The MMC2107 die has a total of 144 bond pads. Of these, the pads that
are not bonded out in the 100-pin package are distributed around the
circumference of the die. This optional group of pins includes:
A[22:0]
R/W
EB[3:0]
CSE[1:0]
TC[2:0]
OE
CS[3:0]
3 x V_DD
3 x V_SS
For more detailed information, see Section 4. Signal Description.
Technical Data
610
Mechanical Specifications
For More Information On This Product,
Go to: www.freescale.com
MMC2107 – Rev. 2.0
MOTOROLA