MMC2107 Datasheet, PDF (587/618 Pages) –

Freescale Semiconductor, Inc.
Electrical Specifications
Thermal Characteristics
22.4 Thermal Characteristics
Table 22-2. Thermal Characteristics
Parameter
Thermal Resistance
Plastic 100-pin LQFP surface mount
Plastic 144-pin LQFP surface mount
Symbol
θ_JA
Value
43.5
46.1
Unit
°C/W
22.5 Power Dissipation
The average chip-junction temperature (T_J) in °C can be obtained from:
T_J = T_A + P_D x θ_JA
(1)
where:
T_A = Ambient temperature, °C
θ_JA = Package thermal resistance, junction-to-ambient, °C/W
P_D = P_INT + P_I/O
P_INT = I_DD × V_DD, watts — chip internal power
P_I/O = Power dissipation on input and output pins — user determined
For most applications, P_I/O < P_INT and can be neglected. An approximate relationship between
P_D and T_J (if P_I/O is neglected) is:
P_D = K ÷ (T_J + 273°C)
(2)
Solving equations 1 and 2 for K gives:
K = P_D × (T_A + 273°C) + θ_JA × P_D ²
(3)
where K is a constant pertaining to the particular part. K can be determined from equation (3)
by measuring P_D (at equilibrium) for a known T_A. Using this value of K, the values of P_D and
T_J can be obtained by solving equations (1) and (2) iteratively for any value of T_A.
22.6 Electrostatic Discharge (ESD) Protection
Table 22-3. ESD Protection Characteristics
Parameter⁽¹⁾
Symbol Value Units
ESD target for human body model
HBM
2000
V
ESD target for machine model
HBM circuit description
MM
200
V
R_Series
1500
W
C
100
pF
MM circuit description
R_Series
0
W
C
200
pF
1. All ESD testing is in conformity with CDF-AEC-Q100 Stress Test Qualification for
Automotive Grade Integrated Circuits.
MMC2107 – Rev. 2.0
MOTOROLA
Electrical Specifications
For More Information On This Product,
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Technical Data
587