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HD64F3039F18 Datasheet, PDF (562/710 Pages) Renesas Technology Corp – Renesas 16-Bit Single-Chip Microcomputer H8 Family / H8/300H Series
Section 18 Electrical Characteristics
Item
Symbol Min
Typ Max
Unit Test Conditions
Input
STBY, NMI,
|Iin|
—
—
1.0
µA Vin = 0.5 V to
leakage
RES, MD2, MD1,
VCC –0.5 V
current
MD
0
Port 7
—
—
1.0
µA Vin = 0.5 V to
AVCC –0.5 V
FWE
—
—
10
Three-state Ports 1, 2, 3, |I |
—
TSI
leakage
5, 6, 8, 9, A, B
current
(off state)
—
1.0
µA V = 0.5 V to
in
VCC –0.5 V
Input
Ports 2, 5
–Ip
50
—
300
µA Vin = 0 V
pull-up
current
Input
NMI, RES
Cin
—
—
50
pF Vin = 0 V,
capacitance All input pins
—
—
20
f = 1 MHz,
except NMI
Ta = 25°C
and RES
Current
Normal
I
—
50
70
mA f = 18 MHz
CC
dissipation operation
*2 *4
Sleep mode
—
35
50
f = 18 MHz
Standby mode*3
—
—
Analog
During A/D
AI
—
CC
power
conversion
supply
Idle
—
current
0.01 5.0
—
20.0
1.7
2.8
0.02 10.0
µA Ta ≤ 50°C
50°C < T
a
mA
µA
RAM standby voltage
VRAM
2.0
—
—
V
Notes: 1. If the A/D converter is not used, do not leave the AVCC and AVSS pins open.
Connect AVCC to VCC, and connect AVSS to VSS.
2. Current dissipation values are for V min = V –0.5 V and V max = 0.5 V with all
IH
CC
IL
output pins unloaded and the on-chip pull-up transistors in the off state.
3.
The
values
are
for
V
RAM
≤
V
CC
<
4.5
V,
V
IH
min
=
V
CC
×
0.9,
and
V
IL
max
=
0.3
V.
4. Power supply current value when programming/erasing in flash memory (Ta = 0°C to
+75°C (regular specifications), Ta = 0°C to +85°C (wide-range specifications)) is 20 mA
(max) higher than the power supply current value in normal operation.
Rev.3.00 Mar. 26, 2007 Page 538 of 682
REJ09B0353-0300