MC9S12T64 Datasheet, PDF (567/608 Pages) Motorola, Inc – Specification

Freescale Semiconductor, Inc.
Electrical Characteristics
General
Table 107 Thermal Package Characteristics⁽¹⁾
Num
Rating
Symbol Min
Typ
1
Thermal Resistance
θ_JA
—
—
1. The values for thermal resistance are achieved by package simulations
Max Unit
51 ˚C/W
I/O
Characteristics
This section describes the characteristics of all 5V I/O pins. All
parameters are not always applicable, e.g. not all pins feature pull
up/down resistances.
Table 108 5V I/O Characteristics
Conditions are shown in Table 106 unless otherwise noted
Num
Rating
Symbol Min
Typ
Max Unit
1 Input High Voltage
V_IH 0.70*V_DD5
—
V_DD5 + 0.3 V
2 Input Low Voltage
V_IL V_SS5 – 0.3
—
0.30*V_DD5 V
3 Input Hysteresis
V_HYS
250
mV
Input Leakage Current (pins in high ohmic input
4
mode)⁽¹⁾
V_in = V_DD5 or V_SS5
I_in
–2.5
—
2.5
µA
Output High Voltage (pins in output mode)
5
Partial Drive IOH = –1.25mA
Full Drive IOH = –3mA
V_OH V_DD5 – 0.8
—
—
V
Output Low Voltage (pins in output mode)
6
Partial Drive IOL = +1.25mA
Full Drive IOL = +3mA
V_OL
—
—
0.8
V
7
Internal Pull Up Device Current,
tested at V_IL Max.
I_PUL
—
—
–130 µA
8
Internal Pull Up Device Current,
tested at V_IH Min.
I_PUH
–10
—
—
µA
9
Internal Pull Down Device Current,
tested at V_IH Min.
I_PDH
—
—
130
µA
10
Internal Pull Down Device Current,
tested at V_IL Max.
I_PDL
10
—
—
µA
11 Input Capacitance
C_in
7
—
pF
Injection current⁽²⁾
12
Single Pin limit I_ICS
–2.5
—
Total Device Limit. Sum of all injected currents I_ICP
–25
2.5
mA
25
Electrical Characteristics
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MC9S12T64Revision 1.1.1