MC9S12T64 Datasheet, PDF (565/608 Pages) Motorola, Inc – Specification

Freescale Semiconductor, Inc.
Electrical Characteristics
General
For power dissipation calculations refer to the subsection Power
Dissipation and Thermal Characteristics.
Table 106 Operating Conditions
Rating
Symbol
Min
Typ
Max Unit
I/O, Regulator and Analog Supply Voltage
Digital Logic Supply Voltage⁽¹⁾
PLL Supply Voltage ⁽²⁾
V_DD5
4.75
5
5.25
V
V_DD
2.25
2.5
2.75
V
V_DDPLL
2.25
2.5
2.75
V
Voltage Difference VDDX to VDDR and VDDA ∆_VDDX
–0.1
0
0.1
V
Voltage Difference VSSX to VSSR and VSSA
∆_VSSX
–0.1
0
0.1
V
Oscillator
f_osc
2
—
16
MHz
Bus Frequency
f_bus
(1/t_bus)
1
—
16.0 MHz
MC9S12T64C
Operating Ambient Temperature Range ⁽²⁾
T_A
–40
27
85
˚C
Operating Junction Temperature Range
T_J
–40
—
100
MC9S12T64V
Operating Ambient Temperature Range ⁽²⁾
T_A
–40
27
105
˚C
Operating Junction Temperature Range
T_J
–40
—
120
MC9S12T64M
Operating Ambient Temperature Range ⁽²⁾
T_A
–40
27
125
˚C
Operating Junction Temperature Range
T_J
–40
—
140
1. The device contains an internal voltage regulator to generate the logic and PLL supply out of the I/O supply. The
absolute maximum ratings apply when this regulator is disabled and the device is powered from an external
source.
2. Please refer to the subsection Power Dissipation and Thermal Characteristics for more details about the relation
between ambient temperature T_A and device junction temperature T_J.
Power Dissipation
and Thermal
Characteristics
Power dissipation and thermal characteristics are closely related. The
user must assure that the maximum operating junction temperature is
not exceeded. The average chip-junction temperature (T_J) in ˚C can be
obtained from:
TJ = TA + (PD • Θ_JA)
TJ = Junction Temperature, [°C ]
TA = Ambient Temperature, [°C ]
PD = Total Chip Power Dissipation, [W]
Electrical Characteristics
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MC9S12T64Revision 1.1.1