English
Language : 

HD6432633 Datasheet, PDF (51/1453 Pages) Renesas Technology Corp – Series of Microcomputers (MCUs: microcomputer units)
24.9 Sub-Sleep Mode
(This function is not available in the H8S/2695).............................................................. 1007
24.9.1 Sub-Sleep Mode..................................................................................................... 1007
24.9.2 Exiting Sub-Sleep Mode........................................................................................ 1008
24.10 Sub-Active Mode
(This function is not available in the H8S/2695).............................................................. 1008
24.10.1 Sub-Active Mode................................................................................................. 1008
24.10.2 Exiting Sub-Active Mode.................................................................................... 1008
24.10.3 Usage Notes......................................................................................................... 1009
24.11 Direct Transitions
(This function is not available in the H8S/2695).............................................................. 1010
24.11.1 Overview of Direct Transitions........................................................................... 1010
24.12 ø Clock Output Disabling Function.................................................................................. 1010
Section 25 Electrical Characteristics
(H8S/2633, H8S/2632, H8S/2631, H8S/2633F) .................................. 1011
25.1 Absolute Maximum Ratings............................................................................................. 1011
25.2 DC Characteristics ............................................................................................................ 1012
25.3 AC Characteristics ............................................................................................................ 1020
25.3.1 Clock Timing....................................................................................................... 1021
25.3.2 Control Signal Timing......................................................................................... 1023
25.3.3 Bus Timing .......................................................................................................... 1025
25.3.4 DMAC Timing .................................................................................................... 1034
25.3.5 Timing of On-Chip Supporting Modules ............................................................ 1038
25.4 A/D Conversion Characteristics ....................................................................................... 1046
25.5 D/A Conversion Characteristics ....................................................................................... 1047
25.6 Flash Memory Characteristics .......................................................................................... 1048
25.7 Usage Note ....................................................................................................................... 1049
Section 26 Electrical Characteristics (H8S/2633R).................................................. 1051
26.1 Absolute Maximum Ratings............................................................................................. 1051
26.2 DC Characteristics ............................................................................................................ 1052
26.3 AC Characteristics ............................................................................................................ 1057
26.3.1 Clock Timing....................................................................................................... 1058
26.3.2 Control Signal Timing......................................................................................... 1060
26.3.3 Bus Timing .......................................................................................................... 1062
26.3.4 DMAC Timing .................................................................................................... 1071
26.3.5 Timing of On-Chip Supporting Modules ............................................................ 1075
26.4 A/D Conversion Characteristics ....................................................................................... 1082
26.5 D/A Conversion Characteristics ....................................................................................... 1083
26.6 Flash Memory Characteristics .......................................................................................... 1084
26.7 Usage Note ....................................................................................................................... 1085
xix