SAM4L Datasheet, PDF (1165/1185 Pages) ATMEL Corporation – ATSAM ARM-based Flash MCU

Figure 43-8. QFN-48 Package Drawing
ATSAM4L4/L2
Note: The exposed pad is not connected to anything internally, but should be soldered to ground to increase board level reliability.
Table 43-23. Device and Package Maximum Weight
140
Table 43-24. Package Characteristics
Moisture Sensitivity Level
Table 43-25. Package Reference
JEDEC Drawing Reference
JESD97 Classification
mg
MSL3
MO-220
E3
42023C–SAM–02/2013
1165