SAM4L Datasheet, PDF (1163/1185 Pages) ATMEL Corporation – ATSAM ARM-based Flash MCU

Figure 43-6. QFN-64 Package Drawing
ATSAM4L4/L2
Note: The exposed pad is not connected to anything internally, but should be soldered to ground to increase board level reliability.
Table 43-17. Device and Package Maximum Weight
200
mg
Table 43-18. Package Characteristics
Moisture Sensitivity Level
MSL3
Table 43-19. Package Reference
JEDEC Drawing Reference
JESD97 Classification
MO-220
E3
42023C–SAM–02/2013
1163