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MC9S12G Datasheet, PDF (1024/1160 Pages) Freescale Semiconductor, Inc – Ignores external trigger. Performs one conversion sequence and stops.
240 KByte Flash Module (S12FTMRG240K2V1)
Table 28-3. P-Flash Memory Addressing
Global Address
0x0_4000 – 0x3_FFFF
Size
(Bytes)
Description
240 K
P-Flash Block
Contains Flash Configuration Field
(see Table 28-4).
The FPROT register, described in Section 28.3.2.9, can be set to protect regions in the Flash memory from
accidental program or erase. The Flash memory addresses covered by these protectable regions are shown
in the P-Flash memory map. The higher address region is mainly targeted to hold the boot loader code
since it covers the vector space. Default protection settings as well as security information that allows the
MCU to restrict access to the Flash module are stored in the Flash configuration field as described in
Table 28-4.
Table 28-4. Flash Configuration Field
Global Address
Size
(Bytes)
Description
0x3_FF00-0x3_FF07
0x3_FF08-0x3_FF0B1
0x3_FF0C1
0x3_FF0D1
Backdoor Comparison Key
8
Refer to Section 28.4.6.11, “Verify Backdoor Access Key Command,” and
Section 28.5.1, “Unsecuring the MCU using Backdoor Key Access”
4
Reserved
1
P-Flash Protection byte.
Refer to Section 28.3.2.9, “P-Flash Protection Register (FPROT)”
1
EEPROM Protection byte.
Refer to Section 28.3.2.10, “EEPROM Protection Register (EEPROT)”
0x3_FF0E1
1
Flash Nonvolatile byte
Refer to Section 28.3.2.16, “Flash Option Register (FOPT)”
0x3_FF0F1
1
Flash Security byte
Refer to Section 28.3.2.2, “Flash Security Register (FSEC)”
1 0x3FF08-0x3_FF0F form a Flash phrase and must be programmed in a single command write sequence. Each byte in
the 0x3_FF08 - 0x3_FF0B reserved field should be programmed to 0xFF.
MC9S12G Family Reference Manual, Rev.1.01
1024
Freescale Semiconductor
This document is valid for the S12G96 and the S12G128 device. All information related to other devices is preliminary.