PIC24FJ64GA705 Datasheet, PDF (409/412 Pages) –

PIC24FJ256GA705 FAMILY
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PIC 24 FJ 256 GA7 05 T - I / PT - XXX
Microchip Trademark
Architecture
Flash Memory Family
Program Memory Size (Kbytes)
Product Group
Pin Count
Tape and Reel Flag (if applicable)
Temperature Range
Package
Pattern
Examples:
a) PIC24FJ256GA705-I/PT:
PIC24F General Purpose Device, 48-Pin,
Industrial Temp., TQFP Package.
b) PIC24FJ256GA702-I/ML:
PIC24F General Purpose Device, 28-Pin,
Industrial Temp., QFN Package
Architecture
24 = 16-Bit Modified Harvard without DSP
Flash Memory Family FJ = Flash Program Memory
Pin Count
02 = 28-pin (QFN, UQFN, SOIC, SSOP, SPDIP)
04 = 44-pin (TQFP)
05 = 48-pin (UQFN, TQFP)
Temperature Range I = -40C to +85C (Industrial)
Package
ML = 28-Lead (6x6 mm) QFN (Plastic Quad Flat)
M6 = 28-Lead (4x4x0.6 mm) UQFN (Ultra Thin Quad Flatpack)
SO = 28-Lead (7.50 mm) SOIC (Plastic Small Outline)
SS = 28-Lead (5.30 mm) SSOP (Plastic Shrink Small Outline)
SP = 28-Lead (300 mil) SPDIP (Skinny Plastic Dual In-Line)
PT = 44-lead (10x10x1 mm) TQFP (Thin Quad Flatpack)
5E = 48-Lead (7x7 mm) UQFN (Plastic Quad Flat)
PT = 48-Lead (7x7x1 mm) TQFP (Thin Quad Flatpack)
Pattern
QTP, SQTP, Code or Special Requirements
(blank otherwise)
ES = Engineering Sample
 2016 Microchip Technology Inc.
DS30010118B-page 409