PIC24FJ64GA705 Datasheet, PDF (358/412 Pages) –

PIC24FJ256GA705 FAMILY
32.1 DC Characteristics
FIGURE 32-1:
PIC24FJ256GA705 FAMILY VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL)
3.6V
(Note 1)
PIC24FJ256GA705
3.6V
(Note 1)
Frequency
32 MHz
Note 1: Lower operating boundary is 2.0V or VBOR (when BOR is enabled), whichever is lower. For best
analog performance, operate above 2.2V.
TABLE 32-1: THERMAL OPERATING CONDITIONS
Rating
PIC24FJ256GA705:
Operating Junction Temperature Range
Operating Ambient Temperature Range
Power Dissipation:
Internal Chip Power Dissipation:
PINT = VDD x (IDD –  IOH)
I/O Pin Power Dissipation:
PI/O =  ({VDD – VOH} x IOH) +  (VOL x IOL)
Maximum Allowed Power Dissipation
Symbol Min
Typ
Max Unit
TJ
-40
—
+85
°C
TA
-40
—
+85
°C
PD
PINT + PI/O
W
PDMAX
(TJ – TA)/JA
W
TABLE 32-2: THERMAL PACKAGING CHARACTERISTICS
Characteristic
Symbol Typ Max Unit Notes
Package Thermal Resistance, 6x6 mm 28-Pin QFN
JA
—
°C/W (Note 1)
Package Thermal Resistance, 4x4x0.6 mm 28-Pin UQFN
JA
—
°C/W (Note 1)
Package Thermal Resistance, 7.50 mm 28-Pin SOIC
JA
—
°C/W (Note 1)
Package Thermal Resistance, 5.30 mm 28-Pin SSOP
JA
—
°C/W (Note 1)
Package Thermal Resistance, 300 mil 28-Pin SPDIP
JA
—
°C/W (Note 1)
Package Thermal Resistance, 6x6x0.5 mm 48-Pin UQFN
JA
33.7
—
°C/W (Note 1)
Package Thermal Resistance, 10x10x1 mm 44-Pin TQFP
JA
28
—
°C/W (Note 1)
Package Thermal Resistance, 7x7x1 mm 48-Pin TQFP
JA
39.3
—
°C/W (Note 1)
Note 1: Junction to ambient thermal resistance; Theta-JA (JA) numbers are achieved by package simulations.
DS30010118B-page 358
 2016 Microchip Technology Inc.