PIC24FJ64GA705 Datasheet, PDF (396/412 Pages) –

PIC24FJ256GA705 FAMILY
48-Lead Thin Quad Flatpack (PT) - 7x7x1.0 mm Body [TQFP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
H
c
E
L
T
(L1)
SECTION A-A
Units
Dimension Limits
Number of Leads
N
Lead Pitch
e
Overall Height
A
Standoff
A1
Molded Package Thickness
A2
Foot Length
L
Footprint
L1
Foot Angle
I
Overall Width
E
Overall Length
D
Molded Package Width
E1
Molded Package Length
D1
Lead Thickness
c
Lead Width
b
Mold Draft Angle Top
D
Mold Draft Angle Bottom
E
MILLIMETERS
MIN
NOM
MAX
48
0.50 BSC
-
-
1.20
0.05
-
0.15
0.95
1.00
1.05
0.45
0.60
0.75
1.00 REF
0°
3.5°
7°
9.00 BSC
9.00 BSC
7.00 BSC
7.00 BSC
0.09
-
0.16
0.17
0.22
0.27
11°
12°
13°
11°
12°
13°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed 0.25mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
5. Datums A-B and D to be determined at center line between leads where leads exit
plastic body at datum plane H
Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2
DS30010118B-page 396
 2016 Microchip Technology Inc.