PIC24FJ64GA705 Datasheet, PDF (394/412 Pages) –

PIC24FJ256GA705 FAMILY
48-Lead Ultra Thin Plastic Quad Flat, No Lead Package (M4) - 6x6 mm Body [UQFN]
With Corner Anchors and 4.6x4.6 mm Exposed Pad
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
R
48
1
2
Y2
EV
C2
C1
X2
EV
Y3
ØV
G2
G1 _Y1
SILK SCREEN
X1
X3
E
RECOMMENDED LAND PATTERN
Notes:
Units
Dimension Limits
Contact Pitch
E
Center Pad Width
X2
Center Pad Length
Y2
Contact Pad Spacing
C1
Contact Pad Spacing
C2
Contact Pad Width (X48)
X1
Contact Pad Length (X48)
Y1
Corner Anchor Pad Width (X4)
X3
Corner Anchor Pad Length (X4)
Y3
Pad Corner Radius (X 20)
R
Contact Pad to Center Pad (X48) G1
Contact Pad to Contact Pad
G2
Thermal Via Diameter
V
Thermal Via Pitch
EV
MILLIMETERS
MIN
NOM
MAX
0.40 BSC
4.70
4.70
6.00
6.00
0.20
0.80
0.90
0.90
0.10
0.25
0.20
0.33
1.20
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
Microchip Technology Drawing C04-2442A-M4
DS30010118B-page 394
 2016 Microchip Technology Inc.