PIC24FJ64GA705 Datasheet, PDF (390/412 Pages) –

PIC24FJ256GA705 FAMILY
44-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1.0 mm Body [TQFP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
H
c
L
θ
(L1)
SECTION A-A
Units
MILLIMETERS
Dimension Limits MIN
NOM
MAX
Number of Leads
Lead Pitch
N
44
e
0.80 BSC
Overall Height
A
-
-
1.20
Standoff
A1
0.05
-
0.15
Molded Package Thickness
A2
0.95
1.00
1.05
Overall Width
E
12.00 BSC
Molded Package Width
E1
10.00 BSC
Overall Length
D
12.00 BSC
Molded Package Length
D1
10.00 BSC
Lead Width
Lead Thickness
b
0.30
0.37
0.45
c
0.09
-
0.20
Lead Length
L
0.45
0.60
0.75
Notes:
Footprint
Foot Angle
L1
1.00 REF
θ
0°
3.5°
7°
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Exact shape of each corner is optional.
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-076C Sheet 2 of 2
DS30010118B-page 390
 2016 Microchip Technology Inc.