PIC24FJ64GA705 Datasheet, PDF (397/412 Pages) –

PIC24FJ256GA705 FAMILY
48-Lead Thin Quad Flatpack (PT) - 7x7x1.0 mm Body [TQFP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
C1
C2
G
SILK SCREEN
48
12
E
Y1
X1
RECOMMENDED LAND PATTERN
Units
Dimension Limits
Contact Pitch
E
Contact Pad Spacing
C1
Contact Pad Spacing
C2
Contact Pad Width (X48)
X1
Contact Pad Length (X48)
Y1
Distance Between Pads
G
MILLIMETERS
MIN
NOM
MAX
0.50 BSC
8.40
8.40
0.30
1.50
0.20
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
Microchip Technology Drawing C04-2300-PT Rev A
 2016 Microchip Technology Inc.
DS30010118B-page 397