PIC24FJ64GA705 Datasheet, PDF (382/412 Pages) –

PIC24FJ256GA705 FAMILY
28-Lead Ultra Thin Plastic Quad Flat, No Lead Package (M6) - 4x4x0.6 mm Body [UQFN]
With Corner Anchors
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
C1
X2
EV
28
1
2
C2 Y2 EV
G3
ØV
G2
G1
Y3
X3
E
Y1
X1
SILK SCREEN
RECOMMENDED LAND PATTERN
Notes:
Units
Dimension Limits
Contact Pitch
E
Center Pad Width
X2
Center Pad Length
Y2
Contact Pad Spacing
C1
Contact Pad Spacing
C2
Contact Pad Width (X28)
X1
Contact Pad Length (X28)
Y1
Contact Pad to Center Pad (X28) G1
Contact Pad to Pad (X24)
G2
Contact Pad to Corner Pad (X8)
G3
Corner Anchor Width (X4)
X3
Corner Anchor Length (X4)
Y3
Thermal Via Diameter
V
Thermal Via Pitch
EV
MILLIMETERS
MIN
NOM
MAX
0.40 BSC
2.00
2.00
3.90
3.90
0.20
0.85
0.52
0.20
0.20
0.78
0.78
0.30
1.00
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-2333-M6 Rev B
DS30010118B-page 382
 2016 Microchip Technology Inc.