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DRA722_17 Datasheet, PDF (162/408 Pages) Texas Instruments – Infotainment Applications Processor
DRA722, DRA724, DRA725, DRA726
SPRS956B – MARCH 2016 – REVISED JANUARY 2017
www.ti.com
5.7.14 PCIEPHY DC Electrical Characteristics
NOTE
The PCIe interfaces are compliant with the electrical parameters specified in PCI Express®
Base Specification Revision 3.0.
5.8 Thermal Characteristics
For reliability and operability concerns, the maximum junction temperature of the Device has to be at or
below the TJ value identified in Table 5-4, Recommended Operating Conditions.
A BCI compact thermal model for this Device is available and recommended for use when modeling
thermal performance in a system.
Therefore, it is recommended to perform thermal simulations at the system level with the worst case
device power consumption.
5.8.1 Package Thermal Characteristics
Table 5-20 provides the thermal resistance characteristics for the package used on this device.
NOTE
Power dissipation of 1.5 W and an ambient temperature of 85ºC is assumed for ABC
package.
Table 5-20. Thermal Resistance Characteristics
NO. PARAMETER
DESCRIPTION
°C/W(1)
AIR FLOW (m/s)(2)
T1 RΘJC
T2 RΘJB
T3
Junction-to-case
Junction-to-board
Junction-to-free air
0.41
N/A
4.74
N/A
11.9
0
T4
T5
RΘJA
Junction-to-moving air
8.9
1
8.0
2
T6
7.4
3
T7
0.22
0
T8
T9
ΨJT
Junction-to-package top
0.22
1
0.22
2
T10
0.23
3
T11
4.12
0
T12
T13 ΨJB
Junction-to-board
3.73
1
3.59
2
T14
3.48
3
(1) These measurements were conducted in a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] measurement,
which was conducted in a JEDEC defined 1S0P system) and will change based on environment as well as application. For more
information, see these EIA/JEDEC standards:
– JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)
– JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
– JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
– JESD51-9, Test Boards for Area Array Surface Mount Packages
(2) m/s = meters per second
162 Specifications
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