HD64F38024HV Datasheet, PDF (667/684 Pages) Renesas Technology Corp – Hardware Manual Renesas 8-Bit Single-Chip Microcomputer H8 Family/H8/300L Super Low Power Series

Appendix H Form of Bonding Pads
Appendix H Form of Bonding Pads
The form of the bonding pads for the HCD64338024, HCD64338023, HCD64338022,
HCD64338021, HCD64338020, HCD64F38024, HCD64F38024R, HCD64338024S,
HCD64338023S, HCD64338022S, HCD64338021S, and HCD64338020S is shown in figure H.1.
Bonding area
Metal layer
72 mm
5 mm
Figure H.1 Bonding Pad Form
Rev. 8.00 Mar. 09, 2010 Page 645 of 658
REJ09B0042-0800