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HD64F38024HV Datasheet, PDF (39/684 Pages) Renesas Technology Corp – Hardware Manual Renesas 8-Bit Single-Chip Microcomputer H8 Family/H8/300L Super Low Power Series
Section 1 Overview
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Chip size: 2.91 mm × 2.91 mm
Voltage level on the back of the chip: GND
Figure 1.7 Bonding Pad Location Diagram of HCD64338024S, HCD64338023S,
HCD64338022S, HCD64338021S, and HCD64338020S (Top View)
Rev. 8.00 Mar. 09, 2010 Page 17 of 658
REJ09B0042-0800