HD64F38024HV Datasheet, PDF (31/684 Pages) Renesas Technology Corp – Hardware Manual Renesas 8-Bit Single-Chip Microcomputer H8 Family/H8/300L Super Low Power Series

1.3 Pin Arrangement and Functions
Section 1 Overview
1.3.1 Pin Arrangement
The H8/38024 Group, H8/38024R Group, H8/38024S Group, and H8/38124 Group pin
arrangements are shown in figures 1.2, 1.3, and 1.4. The bonding pad location diagram of the
HCD64338024, HCD64338023, HCD64338022, HCD64338021, and HCD64338020 is shown in
figure 1.5. The bonding pad coordinates of the HCD64338024, HCD64338023, HCD64338022,
HCD64338021, and HCD64338020 are given in table 1.2. The bonding pad location diagram of
the HCD64F38024, HCD64F38024R is shown in figure 1.6. The bonding pad coordinates of the
HCD64F38024 are given in table 1.3. The bonding pad location diagram of the HCD64338024S,
HCD64338023S, HCD64338022S, HCD64338021S, and HCD64338020S is shown in figure 1.7.
The bonding pad coordinates of the HCD64338024S, HCD64338023S, HCD64338022S,
HCD64338021S, and HCD64338020S are given in table 1.4.
P3₀/UD 61
P3₁/TMOFL 62
P3₂/TMOFH 63
P3₃ 64
P3₄ 65
P3₅ 66
P3₆/AEVH 67
P3₇/AEVL 68
P4₀/SCK_{32 69}
P4₁/RXD_{32 70}
P4₂/TXD_{32 71}
P4₃/IRQ_{0 72}
PB₀/AN_{0 73}
PB₁/AN_{1 74}
PB₂/AN_{2 75}
PB₃/AN₃/IRQ₁/TMIC ₇₆
PB₄/AN_{4 77}
PB₅/AN_{5 78}
PB₆/AN_{6 79}
PB₇/AN_{7 80}
FP-80A, TFP-80C
(Top view)
40 P8₃/SEG₂₈
39 P8₂/SEG₂₇
38 P81/SEG26
37 P80/SEG25
36 P77/SEG24
35 P76/SEG23
34 P75/SEG22
33 ^P74^/SEG21
32 ^P73^/SEG20
31 ^P72^/SEG19
30 ^P71^/SEG18
29 ^P70^/SEG17
28 ^P67^/SEG16
27 ^P66^/SEG15
26 ^P65^/SEG14
25 ^P64^/SEG13
24 ^P63/SEG12
23 ^P62/SEG11
22 ^P61/SEG10
21 ^P60/SEG9
Note: If the on-chip emulator is used, pins 95, 33, 34, and 35 are reserved for the emulator and not available to the user.
Figure 1.2(1) Pin Arrangement (FP-80A, TFP-80C: Top View,
H8/38024 Group, H8/38024R Group, H8/38024S Group)
Rev. 8.00 Mar. 09, 2010 Page 9 of 658
REJ09B0042-0800